Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR31026 RDA Engineer - Advanced Package Develop The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Realtime Defect Analysis (RDA) Engineer in the Advanced Packaging Technology Development department, you will be responsible for managing defect analysis within the rapidly evolving area of advanced IC packaging and next generation 3D Interconnect (3DI) projects. The scope of work involves many emerging and existing forms of inspection and metrology, for both package level and wafer level forms, and requires exceptional analytical and statistical skills. This RDA development role will include next node defect analysis, manual and automated defect classification setup, analyzing results for efficacy, and driving these solutions into the manufacturing environment. Opportunities for expanding process knowledge in other areas other than your area of expertise also exist. You will be a part of the 3DI/Through Silicon Via process team dedicated to vertical stacked memory die products.