Job Description

Position Overview:

We are seeking a highly skilled and motivated Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Requirements:

Educational Background:

Master's or Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.

Experience:

Hands-on experience in process development or packaging R&D. A proven track record in advanced packaging technologies will be an added advantage.

Key Responsibilities:

Innovative Process Development:

Lead the design and development of advanced assembly processes, including 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.

Evaluation and Characterization:

Plan, coordinate, and execute comprehensive evaluations of processes, equipment, and materials. Drive the development of new process qualifications and establish manufacturing guidelines.

Project Collaboration:

Partner with project leaders to align on requirements and enhance capabilities to meet evolving project needs.

Intellectual Property and Reporting:

Prepare detailed engineering reports and contribute to the development of new intellectual properties (IPs) and knowledge areas (KHs), strengthening the IP portfolio in heterogeneous integration.

Customer and Market Engagement:

Engage with internal and external stakeholders to anticipate future demands and develop the capabilities required to address them.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Type of Employment :

Full-Time

Work Location :

Science Park