Job Description

Location : East Working Days: 5 Days, Monday to Friday Working Hours: 8.30am - 5.30pm Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Location : East
Working Days: 5 Days, Monday to Friday
Working Hours: 8.30am - 5.30pm
Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Our Client is a leading technology company providing component-based solutions for security and identification. We are a world-class specialist in the design and manufacture of Micro connectors for smartcards and RFID Antennas and Inlays.

Job Responsibilities:

• Participate in product introduction to deliver new products to market
• Propose new concept of advanced die attach, wire bonding and encapsulation.
• Bring an extensive expertise in chip packaging to improve our end users application knowledge
• Lead the setup of die attach and wire bonding recipes in NPI and new product and profile optimization during mass production
• Pilots problem solving projects linked die attach and wire bonding processes, as well as internal and external quality issues
• Understand current standards in substrate and packaging processes and propose optimization of LXS design for manufacturability, focusing in die attach and wire bonding operation
• Contribute in defining new packaging solutions for Smartcard enabling a better mechanical, thermal or electrical performance on the targeted applications
• Work closely with Engineering to optimize packaging supply base for cost, lead time, quality, standardization
• Specify and recommend efficiency tools and test methods to be developed and validate packaging new designs
• Identify and implement cost saving initiatives related to packaging materials, labour efficiency, integration of process, handling, etc

Experience Requirements :

1. Bachelor degree in Engineering / Manufacturing
2. At least 5 years of semi-conductor back-end process experience
3. Candidates with specialized and in-depth process experience in semiconductor assembly process especially in AOI, tape and reel and shipment packing
4. Candidates with NPI and project management will be an advantage
5. Good communications skill and fluent in English and preferably conversant in another Asian language

Jasmine Toh Law Ting

Direct Line: +65 9273 6741
EA License No: 91C2918
Personnel Registration Number: R2092390

Adecco