Job Description

Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes. Transfer Bonding/Grind/Trim processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address process issues working with Fab10 team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts. Advanced 3D NAND Bonding/Grind/Trim process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications. Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions. Identify process simplification opportunities and drive cross functional teams in implementation. Incorporate best known manufacturing methods into early development phase of upcoming nodes. Design and implement advanced process monitoring and control methodologies. Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. This position requires communications and collaboration with partners both locally and globally. Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. Bachelors' degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experience in leading edge Bonding/Grind/Trim equipment. Familiarity with Bonding/Grind/Trim equipment operation, optical metrology and profilometry In-depth understanding of Bonding/Grind/Trim process mechanisms Understanding of various integration and structural impacts and constraints related to Bonding/Grind/Trim process. An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects. Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously. Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development. Suitable candidates may be considered for Expat posting to Singapore from overseas locations. GJS for this position: E3 and above Hiring Manager: HE JIAN Location: Fab10, 1 North Coast Drive, Singapore Closing Date: 31/07/2025