Job Description

Roles / Responsibilities

• To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment

• Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time

• Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage

• Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductors packaging equipment to their bonding functionalities

• Establish PFMEA process testing for customized kits to ensure machine is performing to customer’s requirements

• Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes

• Setup and real-time monitoring of critical manufacturing processes with abnormally detection criterions and/or SPC

• Training and skillset profiling of assembly technicians

Perquisites

• Degree in Engineering (Materials Science, Electrical or Mechanical) with 5 years of related experience

• Possess strong statistical analysis skillset with demonstrated ability to conduct design-of-experiment (proficient in JMP or Minitab)

Excellent systematic problem solving in areas of containment and counter-measures

• Experience in process development of bonding processes (Wiring Bonding, Die-Bonding or Thermocompression Bonding or Flip Chip) is needed

• Knowledge is coding (Matlab, Python) will be advantageous

• Ability to adjust to shift work as needed during manufacturing volume demand. Typical working hour is 8.30am to 5.30pm. Subject to conference call in Eastern US timing on per need basis