:WHAT YOU DO AT AMD CHANGES EVERYTHINGWe care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences \xe2\x80\x93 the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world\xe2\x80\x99s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_THE ROLE:The successful candidate will collaborate closely with internal teams including Design, Architecture, Foundry Technology Development (FTO), and NPI teams. The role requires deep involvement in advanced CMOS technology nodes (3nm/2nm) and 3D heterogeneous packaging process development, semiconductor characterization, and defining process technology for products.THE PERSON:The candidate will be tasked with leading the design, development, and characterization of 3D test chips for FPGA applications. This includes overseeing all phases from conceptualization, desing to implementation.KEY RESPONSIBLITIES:
MNCJobz.com will not be responsible for any payment made to a third-party. All Terms of Use are applicable.