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About our group: The Multi Disc Writer (MDW) and Multi Disk Spiral Write (MDSW) Product & Process team plays a pivotal role…
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About our group: Seagate Technology is looking for a Test Process & Firmware Engineering Intern to join our product development team at…
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Data Science Intern, MDW / MDSW Product & Process Engineering Seagate Technology Singapore, S00, SG May 12, 2026
About our group: The Multi Disc Writer (MDW) and Multi Disk Spiral Write (MDSW) Product & Process team plays a pivotal role…
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Rapsodo is a leading global sports technology company where passion for performance meets cutting edge innovation. We develop advanced analytics and hardware…
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Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Rapsodo is a Sports Technology company with offices in the USA, Singapore, Turkey & Japan. We develop sports analytics products that are…
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Engineering Intern AI Assistant Development for Test Firmware Engineering Seagate Singapore May 09, 2026
About our group: Join the Test Process & Firmware Engineering (TPFE) team at Seagate Singapore, where we are pioneering the development of…
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About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and…
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Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced…
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About our group: You'll be part of the Test Process & Firmware Engineering team, which is responsible for developing and maintaining firmware…
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Data Science Intern, MDW / MDSW Product & Process Engineering (Diploma Internship) Seagate Singapore Apr 30, 2026
About our group: The Multi Disc Writer (MDW) and Multi Disk Spiral Write (MDSW) Product & Process team plays a pivotal role…
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Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer level packaging and stacking Focus on improving equipment capability,…
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Snr / Principal Engineer, HIG HBM Product Engineering (Media Health Reliability Coding) Micron Singapore Apr 28, 2026
Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification and working with other teams to ensure…
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Principal/Senior Engineer, Advanced Packaging Die Level Technology Engineering Micron Singapore Apr 27, 2026
Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer level packaging and die stacking Chip on Wafer, Chip…
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Technology Development: Develop and enable advanced package technology for various post fab wafer finish and assembly processes Focus on improving product quality,…
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Technology Development: Develop and enable advanced package technology for various post fab wafer finish and assembly processes Focus on improving product quality,…
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Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer level packaging and die stacking Chip on Wafer, Chip…
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At Jabil we strive to make ANYTHING POSSIBLE and EVERYTHING BETTER. We are proud to be a trusted partner for the world's…
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ENABLE your future through light. Excelitas is a global technology leader with more than 7,500 employees, focused on delivering market driven solutions…
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