Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
Establish, review and update specifications, workflow, quality and safety related documentation for production line.
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to production stage.
Process sustaining and control through SPC and periodic defect Pareto Analysis. Lead and drive SPC defects control. Review and update FMEA, Control plan OCAP, etc.
Support customer NPI activities and internal engineering activities.
New material, process & machine development and qualification.
Handle and manage customer audits and 8D reports.
Provide disposition for engineering and production lots.
Conduct process characterization and qualification to establish process baseline.
Requirements:
Bachelors degree in Chemicals, Materials Science, microelectronics, mechanical engineering or relevant engineering degrees.
Knowledge in process engineering, process control engineering and yield enhancement.
Minimum 3 years of hands-on process experience in areas of Wafer-level Fanout packaging production line or LCD/Panel Display production line.
Well versed in 1 or more of the following packaging processes: Die Preparation, Reconstruction, RDL Technology
Experience in SPC, DOE, FEMA, 8D, etc.
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671