Responsibilities:
Develop and optimize bonding process parameters, including temperature, force, and time
Troubleshoot process deviations and work with customers on R&D requirements
Work on Die Bonding, Wire Bonding, Optical Alignment, and Rework processes
Requirements:
Minimum Diploma in Electronics Engineering
Minimum 2 years of experience in an electronics manufacturing environment or related technical environment
Ability to troubleshoot PCBA and perform mechanical and microchip assembly, including handling Epoxy materials
Hands-on experience with Die Bonding, Wire Bonding, and operating and maintaining bonding machines is preferred; training will be provided for candidates without prior experience
Willingness to learn and able to work independently and as part of a team
Ability to support and manage R&D customer requests
Knowledge of semiconductor packaging, advanced interconnects, or similar high-precision assembly is an advantage
Job Types: Full-time, Permanent
Pay: $3,200.00 - $4,800.00 per month
Work Location: In person
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