Responsible for project planning and controlling of targets, risks, costs as well as resources
Performs project meetings and prepare reports for members who involved in the project
Coordinating hardware and software related projects that focus on a continuous improvement of Die bonder machines
Manage projects according to Die Attach Product Innovation process
Requirements:
Min Degree in Mechatronic, Electrical, Automation or its equivalent
At least 2 years project management experience in Semiconductor back end
Good presentation and communication skills
Able to work in a team
Interested candidates who wish to apply for the advertised position to send in your resume.
EA License No: 13C6305
Reg. No.: R1988004
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