Principle Technician Package Dev
Job Description
erform materials & Package characterization and physical Failure Analysis (PFA) to support IC Package Development Engineering activities. Support Package Lab analysis tool materials supplies, tool mai erform materials & Package characterization and physical Failure Analysis (PFA) to support IC Package Development Engineering activities. Support Package Lab analysis tool materials supplies, tool maintenance for Lab operation. Perform package materials characterizations such as die warpage and die strength tests. Perform Lab analysis to support package technology development team for process optimization. Perform package construction characterization for new package products to meet design targeted values. Conduct physical failure analysis such as Sonoscan, X-ray, cross section, focus-ion-beam (FIB) and scanning electron microscope (SEM) analysis to detect package defects
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Job Detail
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Job IdJD1171839
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:$27000 - 54000 per year
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Employment StatusPermanent
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Job LocationSingapore, Singapore
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EducationNot mentioned