Section Manager, Technical Process Engineering (Ref 2022-23396)M/F
Regular/Temporary
Regular
Job description
Work Location: 5A, Serangoon North Avenue 5, Singapore 554575
To manage the package development (WLCSP) in compliance with customer and quality requirement.
To be a primary interface during the package development between the OSATs/ BE plants and the main stakeholders (Division R&D/Design, Corporate packaging dept., GOBM, Program Management, Division QA..).
To propose advanced packaging and process solutions on WCLSP to sustain Division growth.
To be a decision maker in the field of the package development and provide technical expertise as needed.
To be the division package representative in front of the customer during the development activity.
To define and manage the technical project timeline during the project development from zero to the full maturity of the product/package.
Responsible and accountable to drive the assembly yield improvement plan of the impacted products at BE level in order to meet division KPIs.
Profile
Degree in Engineering or Electronics
Deep experience in WLCSP packaging and process
Strong experience on Project Management, Risk Analysis and Design of Experiment.
Ability to handle multi projects across different back end plants
Good know-how on process development
This position requires strong communication skills on technical aspects and early warning awareness.
Leadership skills and team spirit approach are a must
Strong ability on problem solving
Strong ability to work independently and under pressure
Ability to travel whenever needed
Position location
Job location
Asia-Pacific, Singapore, Ang Mo Kio
Candidate criteria
Education level required
4 - Bachelor degree
Experience level required
6-10 years
Languages
English (3- Advanced)
Requester
Desired start date
01/10/2022
Beware of fraud agents! do not pay money to get a job
MNCJobz.com will not be responsible for any payment made to a third-party. All Terms of Use are applicable.