Leads in design, development and implementation of automotive design and development activities using approved engineering processes outlined by the BorgWarner Product and Process Development procedure to meet customers’ requirements
Leads in design, development and verification of power electronics materials and packaging to meet product and process development requirements
Leads in problem solving through application of the engineering sciences of the respective discipline with good engineering judgment
Leads in development and propagation of new technologies and processes
Coordinate development activities with various functional groups to meet project requirements
Provide technical support to manufacturing during pilot runs / tests production start- up period and existing products
Requirement
Minimum a degree in Materials Science, with minimum 8 years’ experience in electronics packaging industry for automotive applications.
Proven track records in successful materials and process development especially in soldering, epoxy molding, silver sintering and ceramic substrate applications
Strong Knowledge of industry trend on electronics packaging materials and processes
Good Knowledge of Silicone Carbide packaging technology
Strong analytical and problem solving skill
Experience in working with global team for successful project execution
Hardware Architect
Key Roles and Responsibility
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