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Engineer, APTD CEM Advanced Packaging Wafer Level Technology Engineering Micron Singapore May 28, 2026Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect) Upgrade process capabilities and reduce production…
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NCS is a leading technology services firm that operates across the Asia Pacific region in over 20 cities, providing consulting, digital services,…
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NCS is a leading technology services firm that operates across the Asia Pacific region in over 20 cities, providing consulting, digital services,…
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Job Description Job Summary As a Sr. Assembly Engineer, you will be tasked to oversee new products releases from Renesas different Product…
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Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality,…
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Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems level expertise…
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Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer level packaging and stacking Focus on improving equipment capability,…
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Principal/Senior Engineer, Advanced Packaging Die Level Technology Engineering Micron Singapore Apr 27, 2026
Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer level packaging and die stacking Chip on Wafer, Chip…
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Technology Development: Develop and enable advanced package technology for various post fab wafer finish and assembly processes Focus on improving product quality,…
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Technology Development: Develop and enable advanced package technology for various post fab wafer finish and assembly processes Focus on improving product quality,…
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Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer level packaging and die stacking Chip on Wafer, Chip…
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Engineer, APTD CEM Advanced Packaging Wafer Level Technology Engineering Micron Singapore Apr 25, 2026
Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect) Upgrade process capabilities and reduce production…
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Project Mgr, Data & AI Engineering ======================================= Date: 16 Dec 2025 Location: Singapore, Singapore Company: Singtel Group NCS is a leading technology…
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Project Mgr, Data & AI Engineering ======================================= Date: 16 Dec 2025 Location: Singapore, Singapore Company: Singtel Group NCS is a leading technology…
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Requirements . Bachelor's degree in Mechanical Engineering . Proficiency in CAD/CAM programs such as Solidworks, Mastercam, or equivalent . Ability to read,…
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Project Mgr, Data & AI Engineering ======================================= Date: 16 Dec 2025 Location: Singapore, Singapore Company: Singtel Group NCS is a leading technology…
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Project Mgr, Data & AI Engineering ======================================= Date: 16 Dec 2025 Location: Singapore, Singapore Company: Singtel Group NCS is a leading technology…
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Mgr, OSAT Assembly Engineering Experience Level: Management Job Type: Regular Location:Singapore, ?, SG, 486058 Requisition ID: 9770 Qorvo (Nasdaq: QRVO) supplies innovative…
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Sr Mgr, Supplier Quality Engineering Experience Level: Management Job Type: Regular Location:Singapore, ?, SG, 486058 Requisition ID: 9771 Qorvo (Nasdaq: QRVO) supplies…
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oin us as a Student Intern in our Assembly Engineering team! Imagine working with a global team of more than 8,000 talented…
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