Purpose of the Job: To support R&D activities for 2.5D wafer level packaging (WLP) processes—including Die Preparation, Chip Attach, and Mold—focusing on process reliability, manufacturability, and integration for advanced semiconductor packages. Key Job Accountabilities: Develop and optimize key 2.5D CoW…
Purpose of the Role: The Procurement Coordinator is responsible for Planning, developing and buying of materials, parts, supplies and equipment. The role ensures cost effective sourcing, timely delivery, and compliance with internal and external policies, directly impacting the success and…
Key Job Responsibilities: Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes Operate and optimize 2D/3D AOI systems and inspection parameters Configure AOI inspection algorithms for new product designs Set up process conditions and equipment…
Key Job Responsibilities: Develop and optimize TBDB processes for various wafer level packaging applications Select appropriate materials (e.g., adhesives, carriers) and stabilize related process conditions Design integrated process flows including wafer thinning, bonding, and debonding Analyze compatibility with downstream processes…
Key Job Responsibilities: Develop and optimize electroplating, seed etching, and PR stripping processes Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation Evaluate and introduce new materials and equipment for plating/etching process integration Conduct pre production…