Job Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR28284 Director Director, MTB MTB Advanced Package Engineering is responsible for defining the strategies and establishing business plans to drive benchmark performance. You will direct resources and aspects of the PWF, HBM engineering resources within the site and collaborate with the Micron network to achieve the business objectives. The job scope will cover all PWF, HBM engineering operations including new product introduction, qualification & ramp, supply chain support, process/equipment/ manufacturing operations, and people development. You will also play an integral leadership role in the Global Assembly & Test Leadership network. Responsibilities

• Drive benchmark culture within the organization in Quality, Cost, Yield, Cycle Time and Safety.
• Define business initiatives and set direction to meet strategic business objectives.
• Lead the site team to deliver on product qualification, output and cost commitments.
• Ensure perfection in Safety, Environmental & Quality standards.
• Drive site performance, continuous improvements and ensure resources are appropriately allocated.
• Collaborate with Central Teams, Business Units, other sites and external groups in Micron’s network to support company’s overall and objectives.
• Mentor site leadership team and develop talent pipeline.
• Provide guidance on people strategies to attract, retain and reward talent and effectively deploy them to maximize every individual’s caliber.

Candidate Key Criteria

• Management of Assembly operations with 10+ year experience.
• Management of PWF (wafer bumping), Wire Bond, Flip Chip, 3DIC, HBM assembly engineering (Top priority)
• Sense of mission for yield improvement
• Strong collaborative attitude with focus on promoting team work while growing the internal network
• Experience working in a multinational organization, and engaging with global leadership in a matrix environment
• Experience in ramping and leading manufacturing sites
• Hire effectively to build and maintain a world class team

About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com . Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.